[Efficient Tinning]Quick in tinning speed and precise positioning for various phone CPU enhancing reballing efficiency.
[IC Chip Protection]Features IC slots that prevent small ICs from sticking and breaking corners during rework.
[Sturdy Stainless Steel]Made from premium stainless steel ensuring durability and long-term use without deformation.
[Wide Compatibility]Compatible with A520 S5mini series and universally applicable for A7 phone .
[Compact and Portable]Lightweight design for easy carrying, making it convenient for technicians and DIY enthusiasts.

Item Type: Phone CPU BGA Reballing Stencil
Product Material: Stainless Steel
Spacing: 0.12mm
Applicable Product Model: For A520, , S5mini series, universal for A7, A5, A3, S5, J7 series.?
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Phone CPU BGA Reballing Stencil