【Reliable】Made of material, this rework pad is extremely and can withstand long-term use without wear or damage.
【Efficient and effective】Designed specifically for mobile phone IC spot soldering and BGA-PCB pad repair, this pad allows for precise and efficient welding, resulting in seamless and repairs.
【Convenient and easy to use】With its peel-off protective layer, this rework pad can be easily applied and used for repair purposes. It eliminates the need for additional tools or complicated procedures, making the repair process quick and hassle-free.
【Secure and reliable attachment】The pads are reinforced with retaining pins, ensuring that they stay securely in place during the soldering process. You can have peace of mind knowing that the pads will not fall off or move, providing a stable and reliable welding surfaces.
【Cost-effective】With each pad being able to replace 100 solder points of different shapes, this rework pad offers excellent value for money. It provides versatility for various repair needs, reducing the need for multiple soldering points and saving both time and resources.
Description
Product Description:
Pad Rework-Mobile Phone IC Spot Soldering-Touch for BGA-PCB Pad.
Flying wire supplementary spot welding sheet mobile phone maintenance motherboards flying wire pasting pad drop point traceless repair without circle.
Just peel off the protective layer, it can be used and repaired.
The for pads are reinforced with retaining pins and will never fall off.
Improve maintenance efficiency, achieve the pad effect& seamless.
The flatness is good, which can effectively prevent the virtual welding caused by unevenness.
Material: Copper wire+ PC plastic plate
Size: approx. 4.8x5.8 cm/2x2.3 inches
1 Pc equals or exceeds 100 solder points of different shapes.