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100mm Large Heatsink Aluminum 3.94x3.94x0.79 Inch / 100x100x20mm + Thermal Conductive Adhesive Tape, Square Heat Sink Cooling for Router Cooling Base and Power Supply IC Graphics Card Memory in Saudi Arabia 100mm Large Heatsink Aluminum 3.94x3.94x0.79 Inch / 100x100x20mm + Thermal Conductive Adhesive Tape, Square Heat Sink Cooling for Router Cooling Base and Power Supply IC Graphics Card Memory in Saudi Arabia 100mm Large Heatsink Aluminum 3.94x3.94x0.79 Inch / 100x100x20mm + Thermal Conductive Adhesive Tape, Square Heat Sink Cooling for Router Cooling Base and Power Supply IC Graphics Card Memory in Saudi Arabia 100mm Large Heatsink Aluminum 3.94x3.94x0.79 Inch / 100x100x20mm + Thermal Conductive Adhesive Tape, Square Heat Sink Cooling for Router Cooling Base and Power Supply IC Graphics Card Memory in Saudi Arabia 100mm Large Heatsink Aluminum 3.94x3.94x0.79 Inch / 100x100x20mm + Thermal Conductive Adhesive Tape, Square Heat Sink Cooling for Router Cooling Base and Power Supply IC Graphics Card Memory in Saudi Arabia 100mm Large Heatsink Aluminum 3.94x3.94x0.79 Inch / 100x100x20mm + Thermal Conductive Adhesive Tape, Square Heat Sink Cooling for Router Cooling Base and Power Supply IC Graphics Card Memory in Saudi Arabia 100mm Large Heatsink Aluminum 3.94x3.94x0.79 Inch / 100x100x20mm + Thermal Conductive Adhesive Tape, Square Heat Sink Cooling for Router Cooling Base and Power Supply IC Graphics Card Memory in Saudi Arabia

100mm Large Heatsink Aluminum 3.94x3.94x0.79inch / 100x100x20mm + Thermal Conductive Adhesive Tape, Square Heat Sink Cooling for Router Base Power Supply IC Graphics Card Memory, Balck

SAR 60

Brand
Awxlumv
Category
Fans & Cooling
Weight
200 g
1 +

Special Features

  • DIMENSIONS: Large aluminum heatsink measures 3.94 x 3.94 x 0.79 inches (100 x 100 x 20mm), providing substantial surface area for heat dissipation
  • VERSATILE APPLICATIONS: Compatible with various devices including routers, power supply units, IC chips, graphics cards, and memory components
  • COMPLETE PACKAGE: Includes thermal conductive adhesive tape for easy installation and optimal heat transfer between components
  • CONSTRUCTION: Made from high-quality aluminum material designed to efficiently conduct and dissipate heat from electronic components
  • DESIGN: Square-shaped heat sink with optimized fin structure maximizes cooling performance and airflow distribution

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