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TSAD-100 Ultra-Conductive Thermal Paste – High-Density Heat Sink Compound for Extreme-Performance CPUs & Power Modules in Saudi Arabia TSAD-100 Ultra-Conductive Thermal Paste – High-Density Heat Sink Compound for Extreme-Performance CPUs & Power Modules in Saudi Arabia TSAD-100 Ultra-Conductive Thermal Paste – High-Density Heat Sink Compound for Extreme-Performance CPUs & Power Modules in Saudi Arabia

TSAD-60 Professional Thermal Paste – High-Density Silicone Grease for PC Cooling, Electronics & Industrial Use

SAR 36
Brand
TOUSEN
Category
Fans & Cooling
Weight
31 g
ModelTSAD-60
– 1 +

Special Features

  • Ultra-Low Thermal Resistance (0.028℃cm²/W) – Industry-leading heat dissipation for high-performance CPUs, GPUs, and power modules, ideal for extreme workloads and overclocked systems.
  • High Density & Viscosity (2.8g/cm³, 140Pa·s) – Dense silicone matrix ensures minimal slump and maximum thermal transfer, even in vertical or complex PCB assemblies.
  • Screen-Printable & Thixotropic – Effortless application for automated production or DIY projects, achieving ultra-thin bond lines (BLT) for precision cooling.
  • Extreme Temperature Range (-50°C to 220°C) – Reliable performance in harsh environments, from sub-zero industrial settings to high-power server racks.
  • Non-Conductive & Solvent-Free – 1.7x10¹²Ω volume resistivity and stable siloxane matrix protect electronics from short circuits and material degradation.

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