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BGA Reballing Stencil Accurate Fast Tin Planting CPU Reballing Template for + Ultra Series + Ultra Series BGA StencilBGA TemplateCPU in Saudi Arabia BGA Reballing Stencil Accurate Fast Tin Planting CPU Reballing Template for + Ultra Series + Ultra Series BGA StencilBGA TemplateCPU in Saudi Arabia BGA Reballing Stencil Accurate Fast Tin Planting CPU Reballing Template for + Ultra Series + Ultra Series BGA StencilBGA TemplateCPU in Saudi Arabia BGA Reballing Stencil Accurate Fast Tin Planting CPU Reballing Template for + Ultra Series + Ultra Series BGA StencilBGA TemplateCPU in Saudi Arabia BGA Reballing Stencil Accurate Fast Tin Planting CPU Reballing Template for + Ultra Series + Ultra Series BGA StencilBGA TemplateCPU in Saudi Arabia BGA Reballing Stencil Accurate Fast Tin Planting CPU Reballing Template for + Ultra Series + Ultra Series BGA StencilBGA TemplateCPU in Saudi Arabia BGA Reballing Stencil Accurate Fast Tin Planting CPU Reballing Template for + Ultra Series + Ultra Series BGA StencilBGA TemplateCPU in Saudi Arabia BGA Reballing Stencil Accurate Fast Tin Planting CPU Reballing Template for + Ultra Series + Ultra Series BGA StencilBGA TemplateCPU in Saudi Arabia BGA Reballing Stencil Accurate Fast Tin Planting CPU Reballing Template for + Ultra Series + Ultra Series BGA StencilBGA TemplateCPU in Saudi Arabia

BGA Reballing Stencil Accurate Fast Tin Planting CPU Reballing Template for + Ultra Series + Ultra Series BGA StencilBGA TemplateCPU

SAR 42
Brand
CFTGIW
Weight
11 g
– 1 +

Special Features

  • Designed with versatility in mind, suitable for smartphones like the X, Galaxy S21, Pixel 3 XL, 7T Pro, and others
  • Compatible with popular smartphone like the Galaxy Note 10 Plus, Galaxy Tab 8.0, Galaxy Watch 3, and others
  • Utilizes high-quality stainless steel material for its robustness and durability
  • Features multiple IC slots for smaller ICs during the reballing process to minimize damage to delicate components
  • Promotes fast tin planting speed for enhanced efficiency during repairs

Description

Item Type: BGA Reballing Stencil Material: Stainl Steel Spacing: 0.12mm Applicable CPU: For Snapdragon 888, for SM8350, for xyn2100 CPU Applicable : For + Ultra series, for G998U G996U Z Flip3 Z Fold3 W 22, etc.

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