Alphacool's double-sided adhesive Core thermal pad can be used to cool all kinds of electronic components where it is important to dissipate waste heat effectively. This significantly improves the performance and durability of the components. Installation is made much easier thanks to the material's stickiness.Flexible and powerfulThe thermal pad is reliable and powerful due to its material composition. With its low thickness, it offers a wide range of application possibilities. It can be flexibly cut to suit individual needs. The adhesive nature enables effortless installation of electrical components such as DDR modules, motherboard components or power supplies.Technical dataDimensions (L x W x H)50x50x0.25mmThermal conductivity (ASTM D5470)1 W/mK ±10%Thickness (ASTM D374)0.25mmstructureGlass fibre fabricContinuous operating temperature-30~+120 °CShort-term operation temperature (30 seconds)180°CDensity (ASTM D792)1.2g/cm³Holding force (PSTC-7)>3000 rpm180° peel strength (aluminum) (PSTC-101)>16N/25mmDielectric breakdown voltage3KV ±10%Thermal impedance @10psi (ASTM D5470)1.26 C-in² / WThermal impedance @30psi (ASTM D5470)1.06 C-in² / WThermal Impedance @50psi (ASTM D5470)1.05 C-in² / WColorwhite