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2-Pack Pre-Soldered ESP32 C3 Supermini Development Board with Headers, 32-Bit RISC-V Single-Core Processor 160MHz, WiFi 4 Bluetooth 5.0 LE Module for Low-Power IoT Projects in Saudi Arabia 2-Pack Pre-Soldered ESP32 C3 Supermini Development Board with Headers, 32-Bit RISC-V Single-Core Processor 160MHz, WiFi 4 Bluetooth 5.0 LE Module for Low-Power IoT Projects in Saudi Arabia 2-Pack Pre-Soldered ESP32 C3 Supermini Development Board with Headers, 32-Bit RISC-V Single-Core Processor 160MHz, WiFi 4 Bluetooth 5.0 LE Module for Low-Power IoT Projects in Saudi Arabia 2-Pack Pre-Soldered ESP32 C3 Supermini Development Board with Headers, 32-Bit RISC-V Single-Core Processor 160MHz, WiFi 4 Bluetooth 5.0 LE Module for Low-Power IoT Projects in Saudi Arabia 2-Pack Pre-Soldered ESP32 C3 Supermini Development Board with Headers, 32-Bit RISC-V Single-Core Processor 160MHz, WiFi 4 Bluetooth 5.0 LE Module for Low-Power IoT Projects in Saudi Arabia 2-Pack Pre-Soldered ESP32 C3 Supermini Development Board with Headers, 32-Bit RISC-V Single-Core Processor 160MHz, WiFi 4 Bluetooth 5.0 LE Module for Low-Power IoT Projects in Saudi Arabia 2-Pack Pre-Soldered ESP32 C3 Supermini Development Board with Headers, 32-Bit RISC-V Single-Core Processor 160MHz, WiFi 4 Bluetooth 5.0 LE Module for Low-Power IoT Projects in Saudi Arabia

2-Pack Pre-Soldered ESP32 C3 Supermini Development Board with Headers, 32-Bit RISC-V Single-Core Processor 160MHz, WiFi 4 Bluetooth 5.0 LE Module for Low-Power IoT Projects

SAR 53
All electronics ship with US style plugs. You may need a voltage converter or a plug adapter.
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Special Features

  • ✅Convenient Pre-Soldered Pin Headers: Ready for immediate prototyping, this ESP32 C3 module comes with pre-soldered headers. Plug it directly into your breadboards without the hassle of manual soldering. It features an advanced 32-bit RISC-V single-core processor running at 160 MHz.
  • ✅Integrated Wi-Fi and Bluetooth LE: Experience seamless wireless integration with native support for 2.4GHz Wi-Fi 4 and modern Bluetooth 5.0 Low Energy. This dual-mode radio solution is engineered for building reliable smart home networks and battery-operated remote sensor nodes.
  • ✅Optimized Memory Storage Footprint: Equipped with 400 KB of internal SRAM and 384 KB of ROM storage space, this miniature development board ensures rapid code execution. The optimized footprint provides ample room for running complex networking stacks alongside custom firmware.
  • ✅Versatile Software Development Support: Benefit from a versatile programming ecosystem with extensive software support. Whether you prefer C/C++, the professional ESP-IDF framework, or MicroPython, this module guarantees a smooth workflow for creating AIoT communication solutions.
  • ✅Ultra-Compact Form Factor and Low Power: Designed specifically as an ultra-compact, cost-effective System-on-Chip MCU, it dramatically reduces power consumption. Its extremely small physical footprint makes it the perfect choice for space-constrained wearable technology designs.

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