CORE CLOCK
2467 MHz (Reference card : 2407MHz)
Fifth-Gen Tensor Cores
Max AI performance with FP4 and DLSS 4
New Streaming Multiprocessors
Optimized for neural shaders
Fourth-Gen Ray Tracing Cores
Built for Mega Geometry
True-to-Life Graphics
Full ray tracing with neural rendering
WINDFORCE COOLING SYSTEM
The WINDFORCE cooling system delivers exceptional thermal performance through a combination of cutting-edge technologies. It features server-grade thermal conductive gel, innovative Hawk fans with alternate spinning, composite copper heat pipes, a large vapor chamber, 3D active fans, and screen cooling.
HAWK FAN
The Hawk Fan features a unique blade design inspired by the aerodynamics of an eagle's wing. This design reduces air resistance and noise levels, resulting in up to a 53.6% increase in air pressure and a 12.5% increase in air volume without compromising acoustics.
GRAPHENE NANO LUBRICANT
Graphene nano lubricant can extend the life of sleeve bearing fan by 2.1 times, close to the life of double ball bearing, and is quieter.
ALTERNATE SPINNING
Reduce the turbulence of adjacent fans and increase airflow pressure.
3D ACTIVE FAN
The 3D Active Fan provides semi-passive cooling, and the fans will remain off when the GPU is in a low load or low power game.
SERVER-GRADE THERMAL CONDUCTIVE GEL
To enhance product quality and reliability, we have introduced server-grade thermal conductive gel for cooling critical components such as VRAM and MOSFETs. This highly deformable, non-fluid gel provides optimal contact for uneven surface and effectively resists deformation from transport or long-term use, unlike traditional thermal pads.
LARGE VAPOR CHAMBER & COMPOSITE COPPER HEAT PIPE
The large vapor chamber directly contacts the GPU, coupled with the composite copper heat pipes, which quickly transfers the heat of the GPU and VRAM to the heatsink.
SCREEN COOLING
Extended heatsink allows air to pass through, providing better heat dissipation.
Triple fan cooling design with Windforce technology for optimal heat dissipation
Custom PCB design with reinforced power delivery
RGB Fusion 2.0 compatibility for customizable lighting
Metal backplate for structural rigidity and additional cooling
Zero fan mode for silent operation under light loads
Factory overclocked for enhanced performance
Dual BIOS switch for different performance profiles
Advanced power phase design for stable overclocking
Triple fan cooling design with Windforce technology for optimal heat dissipation
Custom PCB design with reinforced power delivery
RGB Fusion 2.0 compatibility for customizable lighting
Metal backplate for structural rigidity and additional cooling
Zero fan mode for silent operation under light loads
Factory overclocked for enhanced performance
Dual BIOS switch for different performance profiles
Advanced power phase design for stable overclocking
Triple fan cooling design with Windforce technology for optimal heat dissipation
Custom PCB design with reinforced power delivery
RGB Fusion 2.0 compatibility for customizable lighting
Metal backplate for structural rigidity and additional cooling
Zero fan mode for silent operation under light loads
Factory overclocked for enhanced performance
Dual BIOS switch for different performance profiles
Advanced power phase design for stable overclocking