1. [COMPACT APPEARANCE] and portable design for easy transportation and use anywhere
2. [VERSATILE USAGE] The stencil is compatible with common phone IC chips, offering versatility for various repairs
3. [PRECISE POSITIONING] Ensures quick and accurate tin implantation with stability under high temperatures
4. [DURABLE MATERIAL] Constructed from premium stainless steel for longevity and resilience
5. [FOUR PITCHES] Multiple hole sizes and spacing options cater to different repair requirements
Specification:
Item Type: BGA Reballing Stencil
Pitch: 0.3mm/0.012in, 0.35mm/0.014in, 0.375mm/0.015in, 0.4mm/0.016in, 0.5mm/0.020in
Product Material: Stainless Steel
How to Use:
Use directly
Package List:
1 xBGA Reballing Stencil