ph II N850 specifications
General information
Type
CPU / Microprocessor
Market segment
Mobile
Family
CPU part number
HMN850DCR32GM is an OEM/tray microprocessor
Stepping code
NADHC AD
Frequency ?
2200 MHz
Bus speed ?
One 1800 MHz 16-bit HyperTransport link (3.6 GT/s)
Clock multiplier ?
11
Socket S1 (S1g4)
Weight
0.2oz / 5.7g (measured)
0.2oz / 6.5g (by specifications)
Architecture / Microarchitecture
Microarchitecture
K10
Platform
Danube
Processor c ?
Champlain
c stepping ?
BL-C3
CPUID
100F53
Manufacturing process
0.045 micron silicon-on-insulator (SOI) technology
Data width
64 bit
The number of CPU cores
3
The number of threads
3
Floating Point Unit
Integrated, 128-bit wide
Level 1 cache size ?
3 x 64 KB 2-way set associative instruction caches
3 x 64 KB 2-way set associative data caches
Level 2 cache size ?
3 x 512 KB 16-way set associative caches
Level 3 cache size
None
Cache latency [1]
3 (L1 cache)
15 (L2 cache)
Multiprocessing
Uniprocessor
Extensions and Technologies
MMX instructions
Extensions to MMX
3DNow! technology
Extensions to 3DNow!
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSE4a ?
Low power features
PowerNow!
Integrated peripherals / components
Integrated graphics
None
Memory controller
The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1333, DDR3L-1066
Maximum memory bandwidth (GB/s): 21.3
Other peripherals
HyperTransport technology 3.0
Electrical / Thermal parameters
Thermal Design Power ?
35 Watt