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9Pcs BGA Reballing Stencil Set, 90x90mm Universal Solder Template Kit 0.3-0.76mm 304 Stainless Steel for Laptop CPU Chip Rework Station Repair Tool in Saudi Arabia 9Pcs BGA Reballing Stencil Set, 90x90mm Universal Solder Template Kit 0.3-0.76mm 304 Stainless Steel for Laptop CPU Chip Rework Station Repair Tool in Saudi Arabia 9Pcs BGA Reballing Stencil Set, 90x90mm Universal Solder Template Kit 0.3-0.76mm 304 Stainless Steel for Laptop CPU Chip Rework Station Repair Tool in Saudi Arabia 9Pcs BGA Reballing Stencil Set, 90x90mm Universal Solder Template Kit 0.3-0.76mm 304 Stainless Steel for Laptop CPU Chip Rework Station Repair Tool in Saudi Arabia 9Pcs BGA Reballing Stencil Set, 90x90mm Universal Solder Template Kit 0.3-0.76mm 304 Stainless Steel for Laptop CPU Chip Rework Station Repair Tool in Saudi Arabia 9Pcs BGA Reballing Stencil Set, 90x90mm Universal Solder Template Kit 0.3-0.76mm 304 Stainless Steel for Laptop CPU Chip Rework Station Repair Tool in Saudi Arabia 9Pcs BGA Reballing Stencil Set, 90x90mm Universal Solder Template Kit 0.3-0.76mm 304 Stainless Steel for Laptop CPU Chip Rework Station Repair Tool in Saudi Arabia 9Pcs BGA Reballing Stencil Set, 90x90mm Universal Solder Template Kit 0.3-0.76mm 304 Stainless Steel for Laptop CPU Chip Rework Station Repair Tool in Saudi Arabia 9Pcs BGA Reballing Stencil Set, 90x90mm Universal Solder Template Kit 0.3-0.76mm 304 Stainless Steel for Laptop CPU Chip Rework Station Repair Tool in Saudi Arabia

9Pcs BGA Reballing Stencil Set, 90x90mm Universal Solder Template Kit 0.3-0.76mm 304 Stainless Steel for Laptop CPU Chip Rework Station Repair Tool

SAR 86
Brand
Purokise
Weight
125 g
– 1 +

Special Features

  • Comprehensive 9-Piece Set: This kit includes 9 distinct universal reballing stencils to meet diverse repair needs: 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.6mm (0.9mm pitch), 0.6mm (1.0mm pitch), and 0.76mm. This variety ensures compatibility with a wide range of chip specifications and solder ball sizes.
  • Standard 90x90mm Dimensions: Each template measures approximately 90mm x 90mm (3.54 x 3.54 inches), designed to fit standard BGA rework stations and ball implantation tables. The standardized sizing facilitates easy alignment and secure fixation during the soldering process.
  • Durable 304 Stainless Steel: Manufactured from 304 stainless steel, these stencils are built to withstand high temperatures and environmental wear. The material features a specialized thickness to prevent warping when used with a hot air gun, maintaining a flat profile for precise tin bead application.
  • High-Visibility Markings: Each stencil features precision-etched specifications directly on the surface, indicating the hole diameter and pitch (e.g., 0.6mm P=0.9). This allows technicians to identify and select the appropriate template for their specific BGA chip, streamlining the workflow and reducing identification errors.
  • Versatile Repair Application: Designed for universal usage, these steel meshes are suitable for tin planting on various electronics including laptops, desktops, communication motherboards, north/south bridges, and graphics cards. They effectively assist in repairing cameras, printers, headsets, and computer components.

Description

Item Type: BGA Reballing Stencils
Material: 304 Stainless steel
Size(LxW): Approx. 90 x 90mm / 3.54 x 3.54in
9pcs Templates Included:
1 Piece 0.3mm Universal Template (P=0.58mm)
1 Piece 0.35mm Universal Template (P=0.65mm)
1 Piece 0.4mm Universal Template (P=0.7mm)
1 Piece 0.45mm Universal Template (P=0.78mm)
1 Piece 0.5mm Universal Template (P=0.8mm)
1 Piece 0.55mm Universal Template (P=1.02mm)
2 Pieces 0.6mm Universal Template (P=0.9mm, P=1.0mm)
1 Piece 0.76mm Universal Template (P=1.27mm)

Package List：
9 x BGA Reballing Stencils

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