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Orange Pi 3B Development Board Case with Superior Cooling Performance Aluminum Alloy Material in Saudi Arabia Orange Pi 3B Development Board Case with Superior Cooling Performance Aluminum Alloy Material in Saudi Arabia Orange Pi 3B Development Board Case with Superior Cooling Performance Aluminum Alloy Material in Saudi Arabia Orange Pi 3B Development Board Case with Superior Cooling Performance Aluminum Alloy Material in Saudi Arabia Orange Pi 3B Development Board Case with Superior Cooling Performance Aluminum Alloy Material in Saudi Arabia Orange Pi 3B Development Board Case with Superior Cooling Performance Aluminum Alloy Material in Saudi Arabia Orange Pi 3B Development Board Case with Superior Cooling Performance Aluminum Alloy Material in Saudi Arabia Orange Pi 3B Development Board Case with Superior Cooling Performance Aluminum Alloy Material in Saudi Arabia Orange Pi 3B Development Board Case with Superior Cooling Performance Aluminum Alloy Material in Saudi Arabia

Orange Pi 3B Development Board Case with Superior Cooling Performance Aluminum Alloy Material

SAR 78

Brand
Rcniso
Category
Computer cases
1 +

Special Features

  • Excellent aluminium alloy casing: protects your Orange Pi 3B with durable and high-quality aluminium alloy material and promotes effective heat dissipation for optimal performance.
  • Efficient heat dissipation: Equipped with grooves for easy air escape, which keeps the components at ideal operating temperature and ensures uninterrupted use.
  • Improved heat transfer: Features heat-conducting silicone pads that optimise the efficiency of heat transfer and increase overall system performance.
  • Advanced cooling system: Features a passive cooling fan for exceptional heat dissipation, keeping your development board cool during intensive tasks.
  • User-friendly installation: User-friendly design with precise hole placement for a hassle-free and uncomplicated installation process.

Description

1. Excellent aluminium alloy casing: protects your Orange Pi 3B with durable and high-quality aluminium alloy material and promotes effective heat dissipation for optimal performance.
2. Efficient heat dissipation: Equipped with grooves for easy air escape, which keeps the components at ideal operating temperature and ensures uninterrupted use.
3. Improved heat transfer: Features heat-conducting silicone pads that optimise the efficiency of heat transfer and increase overall system performance.
4. Advanced cooling system: includes a passive cooling fan for exceptional heat dissipation and keeps your development board cool during intensive tasks.
5. User-friendly installation: User-friendly design with precise hole placement for a hassle-free and uncomplicated installation process.

Technical data:
Item type: development shut-off housing.
Material: aluminium alloy.
Fan size: approx. 30 x 30 x 7 mm / 1.18 x 1.18 x 0.28 inches.
Applicable model: fit for orange PI 3B

How to use:
DIY installed and used.

Package list:
1 x lower plate.
1 x top plate.
1 x screw accessory pack.
3 x Heat Conductive Adhesive Stickers
1 x fan.
1 x screwdriver

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